NeoBond HMPU 100 is solvent-less Mono Component PU Adhesive system for lamination of Film/ Foil to Paper/Board on Steinmann type machines for Graphic Art Packaging applications & Nordmechanica type Flexible Packaging application. Normally the coating is applied on to film and then laminated to other substrate (paper/board). Best suited for food packaging.
NeoBond PUR 2A (NCO) & 2B (OH) is Solvent Less Bi Component PU based Adhesive System. It is used in the ratio of 100:60 parts for LLDPE and 100:70 parts for Metalized on high speed solvent less machines like Nord Mechanica. Suitable for laminates using following films: PET, BOPP, MCPP, LLDPE, MET BOPP etc.