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NeoBond HMPU 100 is solvent-less Mono Component PU Adhesive system for lamination of Film/ Foil to Paper/Board on Steinmann type machines for Graphic Art Packaging applications & Nordmechanica type Flexible Packaging application. Normally the coating is applied on to film and then laminated to other substrate (paper/board). Best suited for food packaging.
Solvent Less Mono Component PU Adhesive system for lamination of Paper or Board to Films and Foil on Steinmann type machines for Graphic Art Packaging Applications & Nordmechanica type Flexible Packaging Application. Normally coating is applied on to paper and then laminated to other substrate.
NeoBond PUR 2A (NCO) & 2B (OH) is Solvent Less Bi Component PU based Adhesive System. It is used in the ratio of 100:60 parts for LLDPE and 100:70 parts for Metalized on high speed solvent less machines like Nord Mechanica. Suitable for laminates using following films: PET, BOPP, MCPP, LLDPE, MET BOPP etc.
PUR 80/HD-75N is a two component PU based general to medium performance adhesive for a versatile range of FlexiblePackaging applications and is suitable for standard laminates as well as triplex laminates. This Adhesive shows good bond strength on Al Foil, PET-MPET, LLDPE, BOPP, MBOPP, CPP, MCPP etc.
TechNova is one of the world’s leading suppliers of Total Imaging Solutions for the Graphic Communications industry. Since 1971, TechNova has introduced several new breakthrough technologies that have transformed the imaging processes in various industries.
TechNova offers complete integrated solutions that include consumables, systems, software solutions and services for the print, publishing, packaging, textile, engineering, signage and photo industries. We are also the pioneers of the "Go Green" revolution in the Indian Printing Industry. Our mission is to continuously improve all our business processes and productivity to achieve a level of excellence that is vastly superior to all others in the industry.
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